CTE mismatch (above) leads to elongation and contraction ;
Over time, this mismatch will lead to crack and intermittent or catastrophic failure.
This is the basis for High Change Rate Temperature Cycling Tests, which are typically conducted in a chamber called, Environmental Stress Screening Chamber. Stress Screening Chambers come either in Single Zone or Two Zone type.
QRA is proud to market these ESS chambers under our brand name, and also under our principal from S Korea, ETSP.
Lets go straight to the facts. Below is a diagram of a typical PCB board, which can be used in a myriad of applications from latest smart phones, notebooks, IPads and EV cars. The top part is the silicon chip (think Nvidia, Lenovo and Intel) which does all the microprocessing, and the bottom part connects the chip to the Printed Circuit Board. The connections are provided by solder bumps or balls and the point of contact is called the solder joints.
To improve transmission speed, the area in yellow is called the underfill and the solder bump sits on a contact pad.
The issue with reliability of PCB Boards, is that owing to cost pressures, the silicon chip is typically of a certain Coefficient of Thermal Expansion (CTE) and is normally on the low side, ranging from 2.5 - 4 ppm / C. The organic base substrate for cost reasons has a high CTE something like 20 - 30 ppm / C.
When the device is powered up (smartphone, car or laptop), the underfill expands very fast and longer, while the silicon chip expands slower and at a smaller overall length.
The ESS chamber is simulating the power on and off for anything ranging from 100 cycles to up to 1000 cycles. There are standards which typify the environment which the boards are typically subjected to, to replicate the actual functioning.
Set points can range from below 0 (-20 C) to about 100 C and the change rates vary from 1 C / min up to 20 C / min.
2 Zone ESS Chamber or Thermal Shock Chamber







